1. product profile 1.1 general description planar schottky barrier single diode with an integrated guard ring fo r stress protection, encapsulated in a sod123f small and flat lead smd plastic package. 1.2 features ? low forward voltage ? small and flat lead smd plastic package ? low capacitance ? flat leads: excellent coplanarit y and improved thermal behavior 1.3 applications ? ultra high-speed switching ? voltage clamping ? line termination ? inverse-polarity protection 1.4 quick reference data [1] pulse test: t p 300 s; ? 0.02. 2. pinning information [1] the marking bar indicates the cathode. BAT54H schottky barrier single diode in small sod123f package rev. 02 ? 13 january 2010 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit i f forward current - - 200 ma v r reverse voltage - - 30 v v f forward voltage i f =10ma [1] --400mv table 2. pinning pin description simplified outline symbol 1 cathode [1] 2 anode 2 1 sym00 1 12
BAT54H_2 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 13 january 2010 2 of 8 nxp semiconductors BAT54H schottky barrier single diode in sod123f package 3. ordering information 4. marking 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] reflow soldering is the only recommended soldering method. [3] soldering point of cathode tab. table 3. ordering information type number package name description version BAT54H - plastic surface mounted package; 2 leads sod123f table 4. marking codes type number marking code BAT54H ag table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 30 v i f forward current - 200 ma i frm repetitive peak forward current t p 1s; ? 0.5 - 300 ma i fsm non-repetitive peak forward current t p 10 ms - 600 ma p tot total power dissipation t amb 25 c [1] -375mw t j junction temperature - 125 c t amb ambient temperature ? 65 +125 c t stg storage temperature ? 65 +150 c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] [2] - - 330 k/w r th(j-sp) thermal resistance from junction to solder point [3] --70k/w
BAT54H_2 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 13 january 2010 3 of 8 nxp semiconductors BAT54H schottky barrier single diode in sod123f package 7. characteristics [1] pulse test: t p 300 s; ? 0.02. table 7. characteristics t amb = 25 c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage i f =0.1ma [1] --240mv i f =1ma [1] --320mv i f =10ma [1] --400mv i f =30ma [1] --500mv i f = 100 ma [1] --800mv i r reverse current v r =25v - - 2 a c d diode capacitance v r = 1 v; f = 1 mhz - - 10 pf
BAT54H_2 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 13 january 2010 4 of 8 nxp semiconductors BAT54H schottky barrier single diode in sod123f package (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c (1) t amb = 125 c (2) t amb =85 c (3) t amb =25 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values t amb =25 c; f = 1 mhz fig 3. diode capacitance as a function of reverse voltage; typical values 10 3 10 2 10 ? 1 i f (ma) v f (v) 10 1 1.2 0.8 0.4 0 msa892 (3) (2) (1) (3) (2) (1) 0102030 v r (v) 10 3 10 2 10 ? 1 i r ( a) 10 1 (1) (2) (3) msa893 0102030 0 5 10 15 v r (v) c d (pf) msa891
BAT54H_2 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 13 january 2010 5 of 8 nxp semiconductors BAT54H schottky barrier single diode in sod123f package 8. package outline 9. packing information [1] for further information and the avai lability of packing methods, see section 13 . 10. soldering fig 4. package outline sod123f 04-11-29 dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 BAT54H sod123f 4 mm pitch, 8 mm tape and reel -115 -135 reflow soldering is the only recommended soldering method. dimensions in mm fig 5. reflow soldering footprint sod123f 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ) solder lands solder resist occupied area solder paste
BAT54H_2 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 13 january 2010 6 of 8 nxp semiconductors BAT54H schottky barrier single diode in sod123f package 11. revision history table 9. revision history document id release date data sheet status change notice supersedes BAT54H_2 20100113 product data sheet - BAT54H_1 modifications: ? this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content. BAT54H_1 20050407 product data sheet - -
BAT54H_2 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 13 january 2010 7 of 8 nxp semiconductors BAT54H schottky barrier single diode in sod123f package 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
nxp semiconductors BAT54H schottky barrier single diode in sod123f package ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 13 january 2010 document identifier: BAT54H_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 packing information . . . . . . . . . . . . . . . . . . . . . 5 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 legal information. . . . . . . . . . . . . . . . . . . . . . . . 7 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 contact information. . . . . . . . . . . . . . . . . . . . . . 7 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
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